In the lighting market LED Lighting makes bounds ahead continuously with a request of always higher efficiency and lower costs, so that the manufacturers are constantly looking for new ways and new solutions and for the Solid State Lighting new systems always easer to assembly.
Lumen Fortronic is the Italian landmark event dedicated to electronic components for Lighting and LED, a technical forum that follows the Euroluce and in which the discussed issues will be SSL, easy assembly, optics and reflectors, OLED technology, thermal management. An exhibition symposium with conferences, panel discussions, workshops, meeting areas for supply and demand, presentation of new products and applications, case histories and educational seminars.
SILGA S.p.A. will participate again this year presenting at its stand its solutions for LED Lighting applications, among these the Immersion Silver finishing and the Silver Jumper applicable to the Insulate Metal Substrate (IMS). SILGA has been used a lot Immersion Silver finishing on many of its printed circuit boards (Single-side, PTH, Multilayer and Flexible). This finishing lends itself very well also for the IMS technology as the chemical treatment is compatible with the material treated, aluminium, copper, dielectric and solder resist, it is very planar and the thickness of the treatment is 0.5 microns. This finishing can be used in alternative to the HAL Lead Free.
The benefits are:
- the process is carried out at 50°C and is defined as “cold finishing“;
- the base material doesn’t go through any thermal shock due to the operating temperature of the process, but this happens using the HAL Lead Free process, normally performed at a temperature of 260-265°C;
- maximum uniformity of the thickness on the pads;
- cost similar to the HAL finishing for IMS circuits.
The technique of Silver Jumper (polymeric paste) allows to achieve on the same area of the conductors further tracks, positioned above those already made on the copper base and the insulation among the conductors is guaranteed by a particular solder resist with high dielectric properties. This technique due to an “additive” process allows to unravel at the best, and always on the same level, all the required signals of our printed circuit, without different and more expensive technologies, such as to perform a Double-side PTH circuit placed on a metal substrate. This technique has been used in SILGA capitalising on the great experience gained in the automotive industry and particularly in the mass production of instrument panels and dashboard.