Rigid materials

CEM-1 laminate composed of a core made of cellulose paper and epoxy resin, with 2 external layers of woven glass fiber and copper on one or both sides. Good characteristics of punchability, excellent mechanical and electrical properties, good thermal resistance. Processable by both cutting and drilling and suitable to the various surface finishings, including hot air leveling, to the applications of screen printing pastes and, in the most recent versions, to lead-free soldering. Also available with a high value of CTI.

CEM-3 laminate composed of a core made of non-woven glass fiber (glass matt) and epoxy resin, with 2 external layers of woven glass fiber and copper on one or both sides. Good resistance to temperature and humidity and excellent dimensional stability, also in the z axis, which make it particularly suitable for the production of double-sided plated trough holes printed circuit boards. Because of the same chemical composition, it’s able to replace FR-4 in some applications, offering better punching characteristics.

FR-4 laminate composed of layers of woven glass fiber, whose number varies as a function of the total thickness, and epoxy resin, with copper on one or both sides. It’s generally the primary choice in the manufacturing of double-sided plated trough holes printed circuit boards and, in the form of inner layer and pre-preg, in the construction of multilayer printed circuit boards. Its excellent processability, the elevated mechanical, thermal and chemical characteristics, the resistance to moisture, the good dimensional stability make it suitable for the manufacturing of printed circuit boards with high demands in terms of positioning accuracy; in particular the low coefficient of thermal expansion in the z axis ensures excellent reliability features of the printed circuit over time. The FR4 laminate is normally available with low Tg (130 ° C), medium Tg (150 ° C) and high Tg (170-180 ° C).

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