Electrolytic Tin

The Electrolytic Tin process is one of the possibilities that Silga, given the considerable experience in the galvanic field, is able to offer to fulfill particular requests or special products. In this case, a layer of tin is deposited by an electrolytic process with a thickness from 3 to 10 µm.

This finishing, compliant with the RoHS Directive, can be applied both on rigid and flexible printed circuit boards and ensures in the short term a good solderability.

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