Hot Air Solder Levelling (Lead free)

The operating mechanism of this process is the same of the traditional Hot Air Solder Levelling, with the difference that the alloy used is free from lead, in such a way as to make the surface finish compliant with the RoHS Directive.

The alloys used are usually tin based, with small amounts of silver and copper, but alloys containing nickel also exist.

In consideration that the eutectic point of these alloys is higher than those based on Sn/Pb, the working temperature of HASL Lead-Free is higher and therefore the greater thermal stress to the printed circuit board should be taken into consideration.

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