Immersion Silver

The Immersion Silver process consists in the deposition of an extremely even and planar silver layer.

The thickness ranges from 0.15 to 0.5 ┬Ám and provides excellent solderability with both traditional and lead-free alloys; the solder joint is formed directly between tin and copper.

The chemistry of the process works at low temperature and is designed to give to the silver layer a high resistance to oxidation.

This Immersion Silver finishing is in compliance with the RoHS Directive.

  1. (required)
  2. (valid email required)