Immersion Tin

The immersion tin process consists in the chemical deposition a layer of tin with a thickness variable between 0.8 and 1.2 ┬Ám. It is a finishing in accordance with the RoHS Directive which offers excellent characteristics of flatness and which is able to withstand multiple soldering cycles, also lead-free.

The solder joint is formed directly between tin and copper. The printed circuit boards with chemical tin finishing are suitable for press-fit mounting technology also.

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