Passivated Copper

This process consists in protecting copper with a layer formed by particular organic substances, with indicative thickness of 0,3 ┬Ám. The result is a surface absolutely uniform and planar.

Today’s copper passivation processes are designed to withstand multiple soldering cycles, also lead-free type; the solder joint is formed directly between tin and copper.

The passivated copper finishing, compliant to RoHS Directive, is the least aggressive towards the printed circuit board in terms of chemical and thermal and, if necessary, it can be reworkable.

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