Panel Plating

According to this process method, after the chemical metallization copper is electrolytically deposited on the whole surface and inside the holes. After that the dry film is applied, which has the function of masking the conductors and plated holes to protect them during the subsequent phase of acid etching, by which the copper is removed in the remaining areas.

After etching, the dry film is removed and the printed circuit board proceeds to the next step of soldermask.

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