Pattern Plating

In the technique of Pattern Plating, after the chemical metallization, the printed circuit board’s areas not subject to copper growth are masked by a photosensitive film (dry film), applied with a photographic process which ensures high precision centering.

Subsequently the copper is deposited by electrolysis on the zones left uncovered, so on the conductors and into the holes, followed by a layer of tin which performs the function of metal etching resist. After the electrolytic process the dry film is removed and then with the alkaline etching process the base copper is removed from remaining areas.

After eliminating also the tin layer, the printed circuit proceeds to the step of coating with soldermask.

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