By the term “Thick Copper” are indicated the printed circuit boards manufactured with a thickness of copper, either outer and inner layers, substantially thicker than standard. SILGA, tanks to know-how acquired during the time and to its suitable production process, is able to realize printed circuit boards with a thickness of copper up to 400 micron.
This technology is normally required when dealing with high current intensity or when a strong thermal dissipation is required.
Typical applications are in power electronics, such as power supplies, DC / DC converters, inverters for photovoltaic systems, but also in the automotive sector, especially in the emerging field of electric vehicles. In some cases it may represent an alternative to the use of “busbars“.